John Lau, Cheng Lee, C. Premachandran, Yu Aibin's Advanced MEMS Packaging (Electronic Engineering) PDF

By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

ISBN-10: 0071626239

ISBN-13: 9780071626231

A entire advisor to 3D MEMS packaging equipment and options Written by means of specialists within the box, complicated MEMS Packaging serves as a important reference for these confronted with the demanding situations created via the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant offers state of the art MEMS (microelectromechanical structures) packaging recommendations, reminiscent of low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you decide trustworthy, inventive, high-performance, strong, and low cost packaging options for MEMS units. The booklet also will relief in stimulating additional examine and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, approaches, production, checking out, and reliability. one of the subject matters explored: complex IC and MEMS packaging developments MEMS units, advertisement functions, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding options Actuation mechanisms and built-in micromachining Bubble swap, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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Additional resources for Advanced MEMS Packaging (Electronic Engineering)

Sample text

Evergreen, CO), “Hermetically sealed micro-device package using cold-gas dynamic spray material deposition,” April 20, 2004. Shih, Wu-Sheng (Rolla, MO), Lamb, III, James E. (Rolla, MO), Daffron, Mark (Rolla, MO), “Contact planarization materials that generate no volatile byproducts or residue during curing,” April 6, 2004. Margomenos, Alexandros (Ann Arbor, MI), Herrick, Katherine J. (Westford, MA), Becker, James P. (Bozeman, MT), Katehi, Linda P. B. (Northville, MI), “On-wafer packaging for RFMEMS,” February 24, 2004.

2003. 2002. 2002. 2002. 2002. 2001. 2001. 2001. /Date 1. “Wafer level chip size package for MEMS devices and method for fabricating the same,” Wang, Zhiqi (CN), Yu, Guoqing (CN) (+2), US2009057868 (A1)—2009-03-05. 2. “Method for packaging an optical MEMS device,” Khonsari, Nassim (US), Chui, Clarence (US), EP2029473 (A2)—200903-04. 3. “Patterned contact sheet to protect critical surfaces in manufacturing processes,” Ya, Michael Wang Qing (US), Zhang, Junhong (US), CN101323428 (A)—2008-12-17. 4.

Harney, Kieran Patrick (Andover, MA), “Active alignment as an integral part of optical package design,” November 30, 2004. Tourino, Cory G. (Georgetown, TX), Rice, Janet L. (Austin, TX), Flynn, Gregory (Austin, TX), “Packaging of MEMS devices using a thermoplastic,” October 26, 2004. Ma, Qing (San Jose, CA), “Method of fabricating an integrated circuit that seals a MEMS device within a cavity,” October 26, 2004. Ma, Qing (San Jose, CA), Cheng, Peng (Campbell, CA), Rao, Valluri (Saratoga, CA), “Vacuum-cavity MEMS resonator,” October 26, 2004.

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Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin

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